Extrusion Asia Edition 1-2020

will not achieve the long-term goal of mobility that is as car- bon-neutral as possible. While fuel cell technology in the passenger car sector does not yet appear to be economically viable, due to production costs and a lack of infrastructure, hydrogen-powered drive and pro- duction technologies are already being successfully implemen- ted in other areas. This technology currently appears to be of particular interest for heavy goods transport, local public trans- port, shipbuilding, and the aircraft industry. In those sectors, the primary demand is for safe, lightweight and leak-proof tank systems. CPVs are not only significantly lighter than steel tanks, but also completely resistant to corrosion. Hydrogen is also a first-class energy storage medium, especially if it has been produced using renewable energies. Here, too, tank systems that can withstand the associated pressure, and still store the extremely light gas safely, are needed. Alongside high-tech machines for packaging and automotive products, the company also develops systems for producing thermoplastic pressure vessels. Kautex Maschinenbau’s portfo- lio ranges from the development and production of prototypes and small series to the construction of complete production systems for manufacturing composite pressure vessels. Work- ing together with its customers and materials manufacturers, Kautex continues to advance developments in CPV technology. The hydrogen liner that has just been unveiled is the latest fruit of this cooperation. Kautex Maschinenbau GmbH Kautexstr. 54, 53229 Bonn, Germany www.kautex-group.com 复合材料研究中心进行产品质量检查 Quality inspection in the Composite Center 53 Extrusion Asia Edition 1/2020 弗劳恩霍夫研究所加工技术包装（IVV) 推出制造3D电子元件采用l卷对卷制造工 艺。新的热成型工艺使这一技术得以实现， 它能够通过温度曲线进行更高水平的成型。 这项技术是由在德国德累斯顿弗劳恩霍夫 IVV开发的。 The Fraunhofer Institute for Process Engi- neering and Packaging IVV presentes the manufacture of 3D electronics using the roll- to-roll. A new thermoforming process makes this possible. It allows higher degrees of forming via temperature profiling. It was developed at Fraunhofer IVV Dresden, Germany. 3D电子元件热成型–来自研究所 : 开发了卷对卷制 造工艺的电子组合元件 3D-Electronics, Thermoforming – From research: Roll to Roll Components developed 弗劳恩霍夫 IVV的热成型工艺可以使用卷到卷制造工艺原理制造 3D电子元件（©Fraunhofer IVV） The thermoforming process of the Fraunhofer IVV allows the manufacture of 3D electronic components using the roll-to-roll principle (© Fraunhofer IVV)