Extrusion International USA 2-2020

50 Extrusion International 2/2020 3D-ELECTRONICS, THERMOFORMING – FROM RESEARCH Thermoforming is suitable for large batches of products and is combined here with innovative technologies for temperature control in order to precisely regulate the forming process. Up until now the manufacture of elec- tronic assemblies from structural and functional com- ponents has involved production, assembly, and wir- ing. These are costly steps in terms of time and money. A collaborative project has now developed forming technology whereby a substrate is first processed in its planar state using established technologies for printing and assembly. Only in the last processing step is the 3D geometry generated by forming. Interactive (operat- ing) panels can, for example, be produced at favorable cost. Applications in robotics, home products, medical technology, and the car and aircraft manufacturing in- dustries will benefit from this. The high requirements on ergonomics, design, and functionality in these industries will hence be optimally met. The new process also offers greater design freedom and flexibility. Customization of forming processes The Fraunhofer IVV is developing innovative heating and forming technologies to realize novel products. The Fraunhofer IVV Dresden has a specialist team sup- porting the development of 3D electronic components and offers assistance to companies with aspects such as product design, material selection, and process con- figuration. A self-developed characterization method enables process limits and relative industrial load limits to be determined. In addition, a thermoforming test rig enables the flexible manufacturing of products on a trial basis. For this work a range of forming processes and technologies are available. Using experimental and nu- merical simulation, manufacturing processes and prod- uct geometries can be simulated and optimized. The thermofoming test rig allows the Fraunhofer IVV Dres- den to form a variety of materials with printed electron- ics for companies. Fraunhofer Institute for Process Engineering and Packaging IVV Heidelberger Str. 20, 01189 Dresden, Germany https://www.ivv.fraunhofer.de/en/dresden.html The Fraunhofer Institute for Process Engineering and Packaging IVV presented themanufacture of 3D electronics using the roll-to-roll. Anew thermoforming process makes this possible. It allows higher degrees of forming via temperature profiling. It was developed at Fraunhofer IVVDresden, Germany Roll to Roll Components developed The thermoforming process of the Fraunhofer IVV allows the manufacture of 3D electronic components using the roll-to-roll principle (© Fraunhofer IVV)